J01 Heat Pipe Vapor Chamber for Mobile Phone Cooler Dissip Uniform Plate Increases Heat Dissipation Area with Magnet&Adhesive

Phones & Accessories

J01 Heat Pipe Vapor Chamber for Mobile Phone Cooler Dissip Uniform Plate Increases Heat Dissipation Area with Magnet&Adhesive

₦14,950

Built-in heat pipes for better performance. It needs to be used in conjunction with cooler to increase the cooling area. The package does not include the cooler or the phone. Please use a ruler to measure your phone is suitable or not. Our images have detailed dimensions. Material: aluminum alloy, heat pipe, neodymium iron boron magnet, thermal conductive double-sided tape Thickness: approximately 1.7mm If your phone has a magnetic back, you can use it directly without peeling off the film. If your phone does not have a magnetic back, you need to peel off the film and stick it to the back of the phone. Packaging: 1 pc J01 plate (does not include cooler)

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